SK hynix has announced volume production of its new 12-layer HBM3E memory, with up to 36GB capacities and speeds of 9.6Gbps. The South Korean memory leader announced it has started mass production of the world's first 12-layer HBM3E memory with 36GB, the largest capacity of existing HBM to date. SK hynix plans to supply mass-produced 12-layer HBM3E memory chips to companies (NVIDIA) within the next 12 months, and only 6 months after launching 8-layer HBM3E to customers for the first time in the industry in March 2024.